Date of Graduation


Document Type


Degree Type



Statler College of Engineering and Mineral Resources


Mechanical and Aerospace Engineering

Committee Chair

John M Kuhlman

Committee Co-Chair

Patrick Browning

Committee Member

Donald D Gray


The decrease in sizes of semiconductors and microelectronic devices, also decreases their ability to eject energy in the form of heat due to their small surface areas, which can lead to their failure. Spray cooling is one of the better high heat flux cooling techniques.;As an initial step, the impact of a single liquid drop on a thin liquid film has been simulated and studied, taking the energy equation into consideration. All the cases have been simulated in 3D with an open source CFD package OpenFOAM using Volume of Fluid (VOF) model. The post-processing of the data done in ParaView and MATLAB to obtain the predicted heat flux in the droplet impact cavity, the film thickness beneath the cavity and the sub-cavity liquid volume as functions of time. The sub-cavity film thickness and the liquid volume results are compared with the experiments. The cavity heat flux is predicted to be significantly higher than heat flux predictions outside the cavity.