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A Low Energy Electron Diffraction (LEED) study was performed for iron was epitaxially grown on three different faces of copper (Cu(110), Cu(110), Cu(111)). We were able to grow epitaxially up to 17 layers on Cu(110). A full dynamical analysis was performed using the renormalized forward scattering perturbation method for iron on Cu(100) and Cu(111). The layer doubling method was used for iron on Cu(110). A multiple relaxation approach was employed in analyzing the experimental data. The surface and bulk Debye temperature were determined for copper and for fcc iron on Cu(110), Cu(111) and Cu(110). The surface of Cu(110) presented the biggest contraction of the surface layer. High temperature studies were performed in each of the these three faces of copper. In particular, for 5 layer of iron on Cu(100), we found that the interplanar distance between the first and second layer expands 0.02 A when the evaporation of iron takes place at 463 K. At high temperatures there is evidence of iron diffusion or copper surface segregation.