Date of Graduation

2008

Document Type

Thesis

Degree Type

MS

Committee Chair

Bruce Kang

Abstract

Recently, considerable interest in material characterization of thin film systems and small volumes has led to the increased use of instrumented indentation. Capable of providing a material’s hardness and elastic modulus value, many consider instrumented indentation to be a non destructive testing technique. Traditionally, the indentation contact area is calculated based on the known indenter geometry and depth of penetration. This technique employs the use of high precision depth sensors which account for much of the cost associated with instrumented indentation systems. A multiple partial unloading technique needs no such sensor, as the indentation depth itself is not needed. A removal of this requirement allows for the composition of a portable instrumented indentation system. In this research, such an instrument is developed, as a means for in‐situ material characterization.

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